Magnetron sputter deposition system

The sputter deposition system (450 Sputter System, Bestec GmbH) is equipped with eight tiltable sputter sources. The system can be used for depositing a wide range of dielectric and metallic (magnetic and non-magnetic) materials (2’’ targets). Theoretically, a co-deposition with up to two RF and six DC sources simultaneously is possible. Each source is equipped with a separate shutter, so the deposition of complex stack structures is possible. Currently available materials are:


Elemental materials: Ag, Al, Au, C, Co, Cr, Cu, Fe, Gd, Ge, Ir, Mg, Mn, Mo, Nb, Ni, Pd, Pt, Ru, Si, Ta, Tb, Ti, W, Y

Compounds: Co2Y, CoFeB, CoFe, CoCrPt, CoSi2, FePt, FeAl, MgO, MnGe, MnIr, NdFeB, NiFe, Si3N4, SiO2


The base pressure of the deposition chamber is 5∙10-9 mbar. Nitrogen and Argon are currently available sputter gases. The completely rotatable sample holder can be heated to a maximum temperature of 1100 °C and can hold samples of up to 4’’ diameter. The device is equipped with a load lock, consisting of a 5 slot sample magazine ensuring a high throughput with minimal contamination of the process chamber. The device is remotely controlled via a commercial software which is used for a completely automatized deposition process.



Fig.1 - CAD-image of the 450 Sputter System, Bestec GmbH
Fig. 2 - view inside the vacuum chamber with the 8 tiltable targets
Fig. 3 - shematic principle of the sputter sources
Fig. 4 - Schematic cutout of the target is showing sputtering and concomitant processes in the vicinity of its surface